Atomic Scale Modeling of Chemical Mechanical Polishing Process
نویسندگان
چکیده
منابع مشابه
Device independent process control of dielectric chemical mechanical polishing
The use of the chemical-mechanical polishing (CMP) process in the semiconductor industry is growing rapidly, and it is a critical step in the manufacturing of integrated circuits. The CMP process is complicated by many factors, and controlling all of these factors in a single controller has been unrealistic. One of the most significant factors complicating control is the dependency of the polis...
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Chemical mechanical polishing (CMP) is widely used for pla-narization of advanced interconnect and shallow trench isolation structures in integrated circuit manufacture. Of particular concern is within-die variation in the interlevel dielectric or oxide thickness remaining after polish, due to pattern density variations across the die. 1 Recent modeling of CMP has shown that a " planarization l...
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The decrease in device dimensions is placing extremely tight constraints on many aspects of the CMP process. We outline four key areas that will provide significant steps toward attaining this level of control. In particular, we discuss the need for improved in-line surface topography metrology, and show that that high resolution profilometry appears to meet this need. We demonstrate the need f...
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ژورنال
عنوان ژورنال: Journal of the Korean Institute of Electrical and Electronic Material Engineers
سال: 2005
ISSN: 1226-7945
DOI: 10.4313/jkem.2005.18.5.414